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data sheet broadcom av02-0495en july 13, 2018 overview the envisium led is the premier class of mid-power leds using ts alingap chip technology. envisium leds offer unparalleled performance, engineering, and design flexibility. description the envisium? power plcc-4 smt led is an extension of the broadcom ? plcc-4 smt leds. the package can be driven at high current due to i ts superior package design. the product is able to dissipa te the heat more efficiently compared to the convention al plcc-2 smt leds. these leds produce higher light output with better flux performance compared to the conventional plcc-4 smt leds. the envisium power plcc-4 smt leds are designed for higher reliability and better pe rformance, and operate under a wide range of environmental conditions. the performance characteristics of these new mid-power leds make them uniquely suitable for use in harsh conditions such as in automotive applications, an d in electronics signs and signals. to facilitate easy pick and pla ce assembly, t he leds are packed in eia-compliant tape and reel. every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. these leds are compatible with the ir solder reflow process. due to t he high reliabilit y feature of these products, they also c an be mounted using through- the-wave soldering process. the envisium power plcc-4 smt led is available in three colors: red, red-orange, and amber. features ? industry-standard plcc-4 (plastic leaded chip carrier) ? high reliability led package ? high brightness with optimu m flux performance using ts alingap dice technologies ? available in red, red orange, and amber colors ? high optical efficiency ? higher ambient temperature at the same current possible compared to plcc-2 ? super wide viewing angle at 120 ? available in 8-mm carrier tape on 7-inch reel ? compatible with bo th ir and ttw soldering process applications ? interior automotive C instrument panel backlighting C central console backlighting C navigation and audio system C push button backlighting ? exterior automotive C turn signals C side repeaters Cchmsl C rear combination lamp C puddle light ? electronic signs and signals C channel lettering C contour lighting C indoor variable message sign ? office automation, home appliances, industrial equipment C front panel backlighting C push button backlighting C display backlighting asmc-pxb9-txxxx envisium? power plcc-4 surface mount led
broadcom av02-0495en 2 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led package dimensions device selection guide (t j = 25 c) note: 1. the luminous intensity, i v , is measured at the mechanical a xis of the lamp package. the a ctual peak of the spatial radiation pattern may not be aligned with this axis. 2. v is the total luminous flux outp ut as measured with an integrat ing sphere at mono pulse conditions. 3. tolerance = 12%. color part number min. iv (mcd) max. iv (mcd) test current (ma) dice technology red ASMC-PRB9-TV005 715.0 50 alingap red orange asmc-phb9-tw005 1125.0 50 alingap amber asmc-pab9-tv005 715.0 50 alingap 0.8 0.3 3.5 0.2 2.8 0.2 0.5 0.1 3.2 0.2 2.2 0.2 1.9 0.2 0.1 typ. 0.8 0.1 cathode marking note: all dimensions in mm. ac cc 0.7 0.1 source 1 ac cc cathode marking source 2
broadcom av02-0495en 3 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led part numbering system absolute maximum ratings (t a = 25 c) parameters asmc-pxb9-txxxx dc forward current a a. derate linearly as shown in figure 4 . 70 ma b,c b. drive current between 10 ma and 70 ma is recommended for best long-term performance. c. operation at currents bel ow 5 ma is not recommended. peak forward current d d. duty factor = 10%, frequency = 1 khz. 200 ma power dissipation 240 mw reverse voltage 5v junction temperature 125c operating temperature C40c to +100c storage temperature C40c to +100c a s m c - p x 1 b 9 - t x 2 x 3 x 4 x 5 packaging option color bin selection intensity bin limit intensity bin selection led chip color
broadcom av02-0495en 4 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led optical characteristics (t j = 25 c) electrical characteristics (t j = 25 c) color part number dice technology peak wavelength peak (nm) dominant wavelength d a (nm) a. the dominant wavelength, d , is derived from the cie chromati city diagram and represents t he color of the device. viewing angle ? b (degrees) b. ? is the off-axis angle where t he luminous intensity is 1/2 the peak intensity. luminous efficacy v c (lm/w) c. radiant intensity, ie in watts /steradian, may be calculated f rom the equation ie = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. luminous intensity/ total flux l v (mcd)/ v d (lm) d. v is the total luminous flux output as measured with an integrat ing sphere at mono pulse conditions. typ. typ. typ. typ. typ. red asmc-prb9-txxx5 alingap 639.0 630.0 120 155 0.30 red orange asmc-phb9-txxx5 alingap 623.0 617.0 120 263 0.29 amber asmc-pab9-txxx5 alingap 594.0 592.0 120 500 0.26 part number forward voltage v f (volts) at i f = 50 ma reverse voltage v r at 100 a typ. max. min. asmc-pxb9-txxx5 2.8 3.4 5
broadcom av02-0495en 5 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led figure 1: relative intensity vs . wavelength figure 2: forward current vs. forward voltage wavelength C nm relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 amber 0.6 0.4 0.2 red orange red 0.1 0.3 0.5 0.7 0.9 0 forward voltage C v 0 20 70 80 forward current C ma 40 10 50 30 60 4 3 12 )lxuh5hodwlyhwhvlw yv)ruzdugxuuhw )lxuh 0dlpxp)ruzdugxuuhwyvpelhw7hpshudwxuh hudwhgdvhgr7 -0; 5 - : 020 dc forward current C ma 0 0.4 relative luminous intensity (normalized at 50 ma) 75 35 45 40 50 55 60 65 70 0.8 0.2 1.0 10 0.6 1.2 25 515 30 1.4 0 80 0 20 60 80 120 maximum forward current C ma ambient temperature C c 40 50 60 30 40 20 10 70 100 )lxuh5dgldwlr3dwwhu relative intensity 1.0 0 angle C degrees 0.8 0.7 0.5 0.3 0.1 0.9 0.6 0.2 0.4 -70 -50 -30 30 50 70 90 -90 -10 10
broadcom av02-0495en 6 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led figure 6: recommended sn-pb reflow soldering profile figure 7: recommended pb-free reflow soldering profile 240 q c max. 20 sec. max. 3 q c/sec. max. 120 sec. max. time temperature 183 q c 100-150 q c C6 q c/sec. max. 60-150 sec. 3 q c/sec. max. 217 q c max. 120 sec. 6 q c/sec. max. 3 q c/sec. max. 125 q c 25 q c 255 q c 60 to 150 sec. 10 to 20 sec. time temperature * the time from 25 q c to peak temperature = 6 minutes max. +5 q c -0 q c for detailed information on reflo w soldering of broadcom surfac e-mount leds, refer to application note an 1060, surface mounting smd led indicator components . figure 8: recommended wave soldering profile laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time C seconds temperature C c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 q c (100 q c pcb) solder wave temperature = 245 q c air knife air temperature = 390 q c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force.
broadcom av02-0495en 7 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led figure 9: recommended soldering pattern figure 10: tape leader and trailer dimensions 2.60 (0.103) solder resist represents electrical connectivity between pads 4.50 (0.178) y x 0.40 (0.016) x 0.50 (0.020) y 1.10 (0.043) 1.50 (0.059) dimensions in mm (inches). 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ? 180 reel. 960 mm min. for ? 330 reel. c a user feed direction
broadcom av02-0495en 8 asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led figure 11: tape dimensions figure 12: reeling orientation c a 3.8 0.1 2.29 0.1 0.229 0.01 c c all dimensions in mm. 2 0.05 4 0.1 4 0.1 3.05 0.1 3.5 0.05 8 +0.3 C0.1 1.75 0.1 ? 1.5 +0.1 C0 8 ? 1 +0.1 C0 cathode side printed label user feed direction
asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led broadcom av02-0495en 9 intensity bin select (x 2 x 3 ) individual reel will contain pa rts from one ha lf bin only. intensity bin limits and typical flux tolerance of each bin limit = 12%. color bin select (x 4 ) individual reel will contain pa rts from one full bin only. color bin limits tolerance of each bin limit = 1 nm. x 2 min i v bin x 3 0 full distribution 2 2 half bins starting from x 2 1 3 3 half bins starting from x 2 1 4 4 half bins starting from x 2 1 5 5 half bins starting from x 2 1 6 2 half bins starting from x 2 2 7 3 half bins starting from x 2 2 8 4 half bins starting from x 2 2 9 5 half bins starting from x 2 2 bin id min. (mcd) max. (mcd) v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00 x 4 0 full distribution a 1 and 2 only b 2 and 3 only c 3 and 4 only d 4 and 5 only e 5 and 6 only g 1, 2, and 3 only h 2, 3, and 4 only j 3, 4, and 5 only k 4, 5, and 6 only m 1, 2, 3, and 4 only n 2, 3, 4, and 5 only p 3, 4, 5, and 6 only r 1, 2, 3, 4 , and 5 only s 2, 3, 4, 5 , and 6 only amber/yellow min. (nm) max. (nm) 1 582.0 584.5 2 584.5 587.0 3 587.0 589.5 4 589.5 592.0 5 592.0 594.5 6 594.5 597.0 red orange min. (nm) max. (nm) 1 611.0 616.0 2 616.0 620.0 red min. (nm) max. (nm) full distribution
asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led broadcom av02-0495en 10 packaging option (x 5 ) forward voltage bin table for asmc-pxb9-txxxx only tolerance of each bin limit = 0.05. precautionary notes handling precautions the encapsulation material o f the led is made of silicone for better produc t reliability. com pared to epoxy encapsulant that is hard and br ittle, silicone is softer and flexible. special handling pr ecautions must be observed during assembly of silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. refer to application note an5288, silicone encapsulation for le d: advantages and handling precautions , for more information. ? do not poke sharp objects int o the silicone encapsulant. sharp objects, like tweezers or syringes, might apply excessive force or even pierc e through the silicone and induce failures to the l ed die or wire bond. ? do not touch th e silicone encapsul ant. uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wir e bond. hold the led only by the body. ? do no stack assembled pcbs together. use an appropriate rack to hold the pcbs. ? the surface of the silicone material attracts dusk and dirt easier than epoxy due to its surface tackiness. to remove foreign particles on the surface of silicone, a cotton bud can be used with isopropyl alcohol (ipa). during cleaning, rub the sur face gently without putting much pressure on t he silicone. ultraso nic cleaning is not recommended. ? for automated pick and place, broadcom has tested the following nozzle size t o be working with this led.however, due to the possibility of variations in other parameters, such a s pick and place machine maker/model and other setti ngs of the machine, the customer should verify tha t the nozzle se lected will not cause damage to the led. handling of moisture sensitive devices this product has a moisture sensitive level 3 rating per jedec j-std-020. refer to t he application note an5305, handling of moisture sensit ive surface mount devices , for additional details and a review of proper handling procedures. ? before use: C an unopened moisture barrier bag (mbb) can be stored at < 40 c/90% r h for 12 months. if the actual shelf life has exce eded 12 months and the humidity indicator card (hic) indicates that baking is not required, it is safe to reflow the leds per the original msl rating. C do not open the mbb pr ior to assembly (for example, for iqc). ? control after opening the mbb: C read the hic immediat ely upon opening of mbb. C the leds must be kept a t < 30 c / 60% rh at all times and all high temperature-related processes, including solder ing, curing, or rework, must be completed within 168 hours. ? control for unfinished reel: store unused leds in a seal ed mbb with desiccant or desiccator at <5% rh. option test current package type reel size 5 50 ma top mount 7 inch bin min. max. va 1.9 2.2 vb 2.2 2.5 vc 2.5 2.8 vd 2.8 3.1 ve 3.1 3.4
asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led broadcom av02-0495en 11 ? control of assembled boards: if the pcb soldered with the l eds is to be subjected to other high temperature processes, the pcb must be stored in a sealed mbb with de siccant or desiccator at <5% rh to ensure that all leds have not exceeded their floor life of 168 hours. ? baking is required if: C the hic indicator is not brown at 10% and is azure at 5%. C the leds are exposed to condition of >30c/60% rh at any time. C the led floor life exceeded 168 hrs. the recommended baking cond ition is 60 5oc for 20 hrs. baking should only be done once. ? storage: the soldering terminals o f these broadcom leds are silver plated. if the leds are exposed in ambient environment for too long, the silver plating might become oxidized, which a ffects its solderability performance. as such, keep unused leds in a sealed mbb with desiccant or in desiccator at <5% rh. application precautions ? the drive current of the led must not exceed the maximum allowable limit ac ross temperature as stated in the data sheet. consta nt current driving is recommended to ensure consistent performance. ? leds exhibit slightly different characteristics at different drive currents that might res ult in larger variations in their performance (that is, intensity ,wavelength and forward voltage). set the application current asc lose as possible to the test current to minimize these variations. ? the led is not intended fo r reverse bias. use other appropriate components f or such purposes. when driving the led in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the led. ? do not use the led in the vicinity of materials with sulfur content, such as environment of high gaseous sulfur compounds and corrosive elements. examples of material that may contain sulfur are rubber gasket, rtv (room temperature vulcanizin g) silicone rubber, rubber gloves, and so on. prolonged exposure to such environments might affect t he optical characteristics and product life. ? avoid rapid change in ambie nt temperature, especially in high humidity environments becau se they will cause condensation on the led. ? although the led is rate d as ipx6 according to iec60529: degree of protection provided by enclosure, the test condition may not r epresent actual exposure during application. if the led is intended to be used in outdoor or harsh envir onments, the led must be protected against damages cau sed by rain water, dust, oil, corrosive gas es, external mechanical stress and so on. thermal management optical, electrical, and reliab ility characteristics of the led are affected by temperature. keep the junction temperature (t j ) of the led below the allowable limit at all times. t j can be calculated as below: t j = t a + r j-a x i f x v fmax where: t a = ambient temperature (c) r j-a = thermal resistance from led junction to ambient (c/w) i f = forward current (a) v fmax = maximum forwa rd voltage (v) the complication of using this formula lies in t a and r j-a . actual t a is sometimes subjective and hard to determine. r j-a varies from system to sys tem depending on design and is usually not known. another way of calculating t j is by using solder point temperature t s as follows: t j = t s + r j-s x i f x v fmax where: t s = led solder point temperature as shown in the following illustration (c) r j-s = thermal resistance from junction to solder point (c/w)
asmc-pxb9-txxxx data sheet envisium? power plcc-4 surface mount led broadcom av02-0495en 12 t s can be measured easily by mounting a thermocouple on the soldering jo int as shown in the pr eceding illustration, while r j-s is provided in the data sheet. verify the t s of the leds in the final product to ensure that the leds are operated within all maximum ratings stated in this data sheet. eye safety precautions leds can pose optical hazard s when in operation. do not look directly at operating leds because doing so might be harmful to the eyes. for safet y reasons, use appropriate shielding or personal protective equipment. ts point (cathode) source 1 ts point (cathode) source 2
broadcom, the pulse logo, connect ing everything, avago technolo gies, avago, and the a logo are among the trademarks of broadcom and/or it s affiliates in the un ited states, certain other countries, and/or the eu. copyright ? 2015C2018 broadcom. all rights reserved. the term broadcom refers to broadcom inc. and/or its subsidia ries. for more information, please visit www.broadcom.com . broadcom reserves the right to ma ke changes without further not ice to any products or data he rein to improve reliability, function, or design. information furnished by broadcom is belie ved to be accurate and reliable. however, broadcom does not assume any liability arising out of the application or use of this information, nor the app lication or use of any product or circuit described herein, neither does it convey any license un der its patent rights nor the rights of others. disclaimer broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, c onstruction, maintenance, or d irect operation of a nuclear fa cility or for use in medical devices or applications. the cust omer is solely responsible, an d waives all rights to make clai ms against broadcom or its suppliers, for all lo ss, damage, expense, o r liability in conne ction with such use.

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